Publication
Title
Extending on-die wiring hierarchy with wafer level packaging concepts
Author
Abstract
Language
English
Source (journal)
Proceedings of the IEEE 2004 Internatonal Interconnect technology conference
Source (book)
7th Annual International Interconnect Technology Conference, JUN 07-09, 2004, Burlingame, CA
Publication
2004
ISBN
0-7803-8308-7
Volume/pages
(2004), p. 105-107
ISI
000223636300031
Full text (Publisher's DOI)
UAntwerpen
Publication type
Subject
Affiliation
Publications with a UAntwerp address
External links
Web of Science
Record
Identification
Creation 03.01.2013
Last edited 18.05.2018
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