Publication
Title
EM-induced mass transport at the Cu/barrier interface : a new test structure for rapid assessment at user conditions
Author
Abstract
Starting from the concept of single-damascene Blech structures, a slit-test structure was devised for the assessment of mass transport at the Cu/barrier interface. Much more compatible with standard processing, the proposed slit-test structure easily matches the sensitivity to mass transport of traditional Blech structures. Finite Element Analysis indicates the electron flow in this structure to be concentrated at the Cu/barrier interface, making it electrically very sensitive to mass transport along this diffusion path. Electrical and physical failure analysis suggest a sensitivity high enough to enable wafer-level testing of interface diffusion at user conditions.
Language
English
Source (journal)
Proceedings of the Ieee 2003 international interconnect technology conference
Source (book)
6th Annual International Interconnect Technology Conference, JUN 02-04, 2003, BURLINGAME, CA
Publication
2003
ISBN
0-7803-7797-4
Volume/pages
(2003), p. 21-23
ISI
000184465800006
Full text (Publishers DOI)
UAntwerpen
Publication type
Subject
Affiliation
Publications with a UAntwerp address
External links
Web of Science
Record
Identification
Creation 03.01.2013
Last edited 03.05.2017
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