Title
EM-induced mass transport at the Cu/barrier interface : a new test structure for rapid assessment at user conditionsEM-induced mass transport at the Cu/barrier interface : a new test structure for rapid assessment at user conditions
Author
Publication type
conferenceObject
Publication
Subject
Physics
Computer. Automation
Source (journal)
Proceedings of the Ieee 2003 international interconnect technology conference
Source (book)
6th Annual International Interconnect Technology Conference, JUN 02-04, 2003, BURLINGAME, CA
Volume/pages
(2003), p. 21-23
ISBN
0-7803-7797-4
ISI
000184465800006
Carrier
E
Target language
English (eng)
Full text (Publishers DOI)
Affiliation
University of Antwerp
Abstract
Starting from the concept of single-damascene Blech structures, a slit-test structure was devised for the assessment of mass transport at the Cu/barrier interface. Much more compatible with standard processing, the proposed slit-test structure easily matches the sensitivity to mass transport of traditional Blech structures. Finite Element Analysis indicates the electron flow in this structure to be concentrated at the Cu/barrier interface, making it electrically very sensitive to mass transport along this diffusion path. Electrical and physical failure analysis suggest a sensitivity high enough to enable wafer-level testing of interface diffusion at user conditions.
E-info
http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000184465800006&DestLinkType=RelatedRecords&DestApp=ALL_WOS&UsrCustomerID=ef845e08c439e550330acc77c7d2d848
http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000184465800006&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=ef845e08c439e550330acc77c7d2d848
Handle