|
Title
|
|
|
|
EM-induced mass transport at the Cu/barrier interface : a new test structure for rapid assessment at user conditions
|
|
|
Author
|
|
|
|
|
|
|
Abstract
|
|
|
|
| Starting from the concept of single-damascene Blech structures, a slit-test structure was devised for the assessment of mass transport at the Cu/barrier interface. Much more compatible with standard processing, the proposed slit-test structure easily matches the sensitivity to mass transport of traditional Blech structures. Finite Element Analysis indicates the electron flow in this structure to be concentrated at the Cu/barrier interface, making it electrically very sensitive to mass transport along this diffusion path. Electrical and physical failure analysis suggest a sensitivity high enough to enable wafer-level testing of interface diffusion at user conditions. |
|
|
|
Language
|
|
|
|
English
|
|
|
Source (journal)
|
|
|
|
Proceedings of the Ieee 2003 international interconnect technology conference
|
|
|
Source (book)
|
|
|
|
6th Annual International Interconnect Technology Conference, JUN 02-04, 2003, BURLINGAME, CA
|
|
|
Publication
|
|
|
|
2003
|
|
|
ISBN
|
|
|
|
0-7803-7797-4
|
|
|
DOI
|
|
|
|
10.1109/IITC.2003.1219700
|
|
|
Volume/pages
|
|
|
|
(2003)
, p. 21-23
|
|
|
ISI
|
|
|
|
000184465800006
|
|
|
Full text (Publisher's DOI)
|
|
|
|
|
|