|
Title
|
|
|
|
Reliability of copper dual damascene influenced by pre-clean
| |
|
Author
|
|
|
|
| |
|
Language
|
|
|
|
English
| |
|
Source (journal)
|
|
|
|
PROCEEDINGS OF THE 9TH INTERNATIONAL SYMPOSIUM ON THE PHYSICAL & FAILURE
ANALYSIS OF INTEGRATED CIRCUITS
| |
|
Source (book)
|
|
|
|
9th International Symposium on the Physical and Failure Analysis of, Integrated Circuits (IPFA 2002), JUL 08-12, 2002, SINGAPORE, SINGAPORE
| |
|
Publication
|
|
|
|
New york
:
Ieee
,
2002
| |
|
ISBN
|
|
|
|
0-7803-7416-9
| |
|
DOI
|
|
|
|
10.1109/IPFA.2002.1025629
| |
|
Volume/pages
|
|
|
|
(2002)
, p. 118-123
| |
|
ISI
|
|
|
|
000177689400022
| |
|
Full text (Publisher's DOI)
|
|
|
|
| |
|