Title 



Macromodeling of highspeed interconnects by positive interpolation of vertical segments
 
Author 



 
Abstract 



In this paper a novel macromodeling scheme is presented to model the per unit of length (p.u.l.) parameters of uniform transmission lines. In particular, it is focused on single onchip interconnects, because their p.u.l. parameters are influenced by the presence of semiconductor (s) and as such exhibit a strong frequencydependency, making the modeling process harder. Starting from a set of very accurate tabulated data samples, obtained by twodimensional electromagnetic modeling, rational models for the four p.u.l. parameters are constructed. The novelty of the approach lies in the fact that the rational models are positive by construction and that a controllable accuracy is obtained. These models can then further be used to construct multivariate models, e.g., for variability analysis. Here, the novel scheme is applied to an onchip inverted embedded microstrip line, of which the signal integrity behavior is assessed in both the frequency and the time domain, demonstrating the applicability of the macromodels.   
Language 



English
 
Source (journal) 



Applied mathematical modelling.  Cambridge  
Publication 



Cambridge : 2013
 
ISSN 



0307904X
 
Volume/pages 



37:7(2013), p. 48744882
 
ISI 



000316579600023
 
Full text (Publisher's DOI) 


  
Full text (publisher's version  intranet only) 


  
