Exploring alternative metals to Cu and W for interconnects applications using automated first-principles simulationsExploring alternative metals to Cu and W for interconnects applications using automated first-principles simulations
Faculty of Sciences. Chemistry
Plasma, laser ablation and surface modeling - Antwerp (PLASMANT)
2015Pennington (N.J.) :Electrochemical society, 2015
ECS journal of solid state science and technology / Electrochemical Society. - Pennington (N.J.), s.a.
4(2015):1, p. N3127-N3133
University of Antwerp
The bulk properties of elementary metals and copper based binary alloys have been investigated using automated first-principles simulations to evaluate their potential to replace copper and tungsten as interconnecting wires in the coming CMOS technology nodes. The intrinsic properties of the screened candidates based on their cohesive energy and on their electronic properties have been used as a metrics to reflect their resistivity and their sensitivity to electromigration. Using these values, the 'performances' of the alloys have been benchmarked with respect to the Cu and W ones. It turns out that for some systems, alloying Cu with another element leads to a reduced tendency to electromigration. This is however done at the expense of a decrease of the conductivity of the alloy with respect to the bulk metal. (C) 2014 The Electrochemical Society. All rights reserved.