Title
Exploring alternative metals to Cu and W for interconnects applications using automated first-principles simulations Exploring alternative metals to Cu and W for interconnects applications using automated first-principles simulations
Author
Faculty/Department
Faculty of Sciences. Chemistry
Publication type
article
Publication
Pennington (N.J.) :Electrochemical society ,
Subject
Physics
Source (journal)
ECS journal of solid state science and technology / Electrochemical Society. - Pennington (N.J.), s.a.
Volume/pages
4(2015) :1 , p. N3127-N3133
ISSN
2162-8769
ISI
000349547900018
Carrier
E
Target language
English (eng)
Full text (Publishers DOI)
Affiliation
University of Antwerp
Abstract
The bulk properties of elementary metals and copper based binary alloys have been investigated using automated first-principles simulations to evaluate their potential to replace copper and tungsten as interconnecting wires in the coming CMOS technology nodes. The intrinsic properties of the screened candidates based on their cohesive energy and on their electronic properties have been used as a metrics to reflect their resistivity and their sensitivity to electromigration. Using these values, the 'performances' of the alloys have been benchmarked with respect to the Cu and W ones. It turns out that for some systems, alloying Cu with another element leads to a reduced tendency to electromigration. This is however done at the expense of a decrease of the conductivity of the alloy with respect to the bulk metal. (C) 2014 The Electrochemical Society. All rights reserved.
Full text (open access)
https://repository.uantwerpen.be/docman/irua/9d39db/9903.pdf
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