Publication
Title
Exploring alternative metals to Cu and W for interconnects applications using automated first-principles simulations
Author
Abstract
The bulk properties of elementary metals and copper based binary alloys have been investigated using automated first-principles simulations to evaluate their potential to replace copper and tungsten as interconnecting wires in the coming CMOS technology nodes. The intrinsic properties of the screened candidates based on their cohesive energy and on their electronic properties have been used as a metrics to reflect their resistivity and their sensitivity to electromigration. Using these values, the 'performances' of the alloys have been benchmarked with respect to the Cu and W ones. It turns out that for some systems, alloying Cu with another element leads to a reduced tendency to electromigration. This is however done at the expense of a decrease of the conductivity of the alloy with respect to the bulk metal. (C) 2014 The Electrochemical Society. All rights reserved.
Language
English
Source (journal)
ECS journal of solid state science and technology / Electrochemical Society. - Pennington (N.J.), s.a.
Publication
Pennington (N.J.) : Electrochemical society, 2015
ISSN
2162-8769
2162-8777
Volume/pages
4:1(2015), p. N3127-N3133
ISI
000349547900018
Full text (Publisher's DOI)
Full text (open access)
UAntwerpen
Faculty/Department
Research group
Publication type
Subject
Affiliation
Publications with a UAntwerp address
External links
Web of Science
Record
Identification
Creation 08.05.2015
Last edited 16.06.2017
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