Publication
Title
Exploring alternative metals to Cu and W for interconnects : an ab initio Insight
Author
Abstract
The properties of alternative metals to Cu and W for interconnect applications are reviewed based on first-principles simulations and benchmarked in terms of intrinsic bulk resistivity and electromigration.
Language
English
Source (journal)
2014 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE / ADVANCED METALLIZATION CONFERENCE (IITC/AMC)
Source (book)
IEEE International Interconnect Technology Conference / Advanced, Metallization Conference (IITC/AMC), MAY 20-23, 2014, San Jose, CA
Publication
New york : Ieee, 2014
ISBN
978-1-4799-5018-8
Volume/pages
(2014), p. 193-195
ISI
000356605200027
Full text (publisher's version - intranet only)
UAntwerpen
Faculty/Department
Research group
Publication type
Subject
Affiliation
Publications with a UAntwerp address
External links
Web of Science
Record
Identification
Creation 03.09.2015
Last edited 19.11.2017
To cite this reference