Title
Exploring alternative metals to Cu and W for interconnects : an ab initio Insight Exploring alternative metals to Cu and W for interconnects : an ab initio Insight
Author
Faculty/Department
Faculty of Sciences. Chemistry
Publication type
conferenceObject
Publication
New york :Ieee ,
Subject
Physics
Engineering sciences. Technology
Source (journal)
2014 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE / ADVANCED METALLIZATION CONFERENCE (IITC/AMC)
Source (book)
IEEE International Interconnect Technology Conference / Advanced, Metallization Conference (IITC/AMC), MAY 20-23, 2014, San Jose, CA
Volume/pages
(2014) , p. 193-195
ISBN
978-1-4799-5018-8
ISI
000356605200027
Carrier
E
Target language
English (eng)
Affiliation
University of Antwerp
Abstract
The properties of alternative metals to Cu and W for interconnect applications are reviewed based on first-principles simulations and benchmarked in terms of intrinsic bulk resistivity and electromigration.
E-info
http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000356605200027&DestLinkType=RelatedRecords&DestApp=ALL_WOS&UsrCustomerID=ef845e08c439e550330acc77c7d2d848
http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000356605200027&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=ef845e08c439e550330acc77c7d2d848
https://repository.uantwerpen.be/docman/iruaauth/3048f6/127034.pdf
Handle