|
Title
|
|
|
|
Metallic ceramics for low resitivity interconnects : an ab initio insight
| |
|
Author
|
|
|
|
| |
|
Abstract
|
|
|
|
| The scalability potential of low resistivity ternary metallic alloys (MAX) as an interconnect medium has been benchmarked against copper through first-principle simulations. We report that some carbon and nitrogen MAX phases have the potential to display a reduced sensitivity of their intrinsic resistivity to scaling, while showing improved electromigration properties. |
| |
|
Language
|
|
|
|
English
| |
|
Source (journal)
|
|
|
|
Proceedings of the IEEE ... International Interconnect Technology Conference. - Piscataway, N.J, 1998, currens
| |
|
Source (book)
|
|
|
|
IEEE International Interconnect Technology Conference (IITC), JUN 04-07, 2018, Santa Clara, CA
| |
|
Publication
|
|
|
|
New york
:
Ieee
,
2018
| |
|
ISBN
|
|
|
|
978-1-5386-4337-2
978-1-5386-4337-2
| |
|
Volume/pages
|
|
|
|
(2018)
, p. 160-162
| |
|
ISI
|
|
|
|
000468672900053
| |
|
Full text (publisher's version - intranet only)
|
|
|
|
| |
|