Title
|
|
|
|
Analysis of internal stress build-up during deposition of nanocrystalline Ni thin films using transmission electron microscopy
|
|
Author
|
|
|
|
|
|
Language
|
|
|
|
English
|
|
Source (journal)
|
|
|
|
Thin solid films : an international journal on the science and technology of thin and thick films. - Lausanne, 1967, currens
|
|
Publication
|
|
|
|
Lausanne
:
2020
|
|
ISSN
|
|
|
|
0040-6090
[print]
1879-2731
[online]
|
|
DOI
|
|
|
|
10.1016/J.TSF.2020.138076
|
|
Volume/pages
|
|
|
|
707
(2020)
, p. 1-7
|
|
Article Reference
|
|
|
|
138076
|
|
ISI
|
|
|
|
000539312200011
|
|
Medium
|
|
|
|
E-only publicatie
|
|
Full text (Publisher's DOI)
|
|
|
|
|
|
Full text (open access)
|
|
|
|
|
|
Full text (publisher's version - intranet only)
|
|
|
|
|
|