Publication
Title
Adhesion strength of the epoxy polymer/copper interface for use in microelectronics
Author
Language
English
Source (journal)
Journal of the electrochemical society. - New York, N.Y.
Publication
New York, N.Y. : 2005
ISSN
0013-4651
Volume/pages
152:6(2005), p. C442-C455
ISI
000229475300057
Full text (Publisher's DOI)
UAntwerpen
Faculty/Department
Research group
Publication type
Subject
Affiliation
Publications with a UAntwerp address
External links
Web of Science
Record
Identification
Creation 11.03.2009
Last edited 17.06.2017
To cite this reference