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Title
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Adhesion strength of the epoxy polymer/copper interface for use in microelectronics
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Author
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Language
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English
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Source (journal)
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Journal of the electrochemical society. - New York, N.Y.
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Publication
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New York, N.Y.
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2005
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ISSN
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0013-4651
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DOI
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10.1149/1.1904911
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Volume/pages
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152
:6
(2005)
, p. C442-C455
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ISI
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000229475300057
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Full text (Publisher's DOI)
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