Title
Adhesion strength of the epoxy polymer/copper interface for use in microelectronics Adhesion strength of the epoxy polymer/copper interface for use in microelectronics
Author
Faculty/Department
Faculty of Sciences. Chemistry
Publication type
article
Publication
New York, N.Y. ,
Subject
Chemistry
Source (journal)
Journal of the electrochemical society. - New York, N.Y.
Volume/pages
152(2005) :6 , p. C442-C455
ISSN
0013-4651
ISI
000229475300057
Carrier
E
Target language
English (eng)
Full text (Publishers DOI)
Affiliation
University of Antwerp
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