Title
Investigation of etching and deposition processes of <tex>$Cl_{2}/O_{2}/Ar$</tex> inductively coupled plasmas on silicon by means of plasmasurface simulations and experiments Investigation of etching and deposition processes of <tex>$Cl_{2}/O_{2}/Ar$</tex> inductively coupled plasmas on silicon by means of plasmasurface simulations and experiments
Author
Faculty/Department
Faculty of Sciences. Chemistry
Publication type
article
Publication
London ,
Subject
Chemistry
Source (journal)
Journal of physics: D: applied physics. - London
Volume/pages
42(2009) , p. 095204,1-095204,13
ISSN
0022-3727
ISI
000265531000030
Carrier
E
Target language
English (eng)
Full text (Publishers DOI)
Affiliation
University of Antwerp
Abstract
In this paper, a simulation method is described to predict the etching behaviour of Cl2/O2/Ar inductively coupled plasmas on a Si substrate, as used in shallow trench isolation for the production of electronic devices. The hybrid plasma equipment model (HPEM) developed by Kushner et al is applied to calculate the plasma characteristics in the reactor chamber and two additional Monte Carlo simulations are performed to predict the fluxes, angles and energy of the plasma species bombarding the Si substrate, as well as the resulting surface processes such as etching and deposition. The simulations are performed for a wide variety of operating conditions such as gas composition, chamber pressure, power deposition and substrate bias. It is predicted by the simulations that when the fraction of oxygen in the gas mixture is too high, the oxidation of the Si substrate is superior to the etching of Si by chlorine species, resulting in an etch rate close to zero as is also observed in the experiments.
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