Title
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Transmission electron microscopy investigation of Bi-2223/Ag tapes
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Author
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Abstract
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The microstructure of (Bi,Pb)2Sr2Ca2Cu3Ox (Bi-2223) tapes has been investigated by means of transmission electron microscopy (TEM) and high-resolution TEM. The emphasis has been placed on: (1) an examination of the grain morphology and size, (2) grain and colony boundary angles, which are formed during the tape processing, (3) a study of the grain boundaries on an atomic scale, including intergrowth investigations. Tapes with different process parameters have been compared with respect to the microstructure. A fully processed tape has on the average 50% thicker Bi-2223 grains than a tape after the first annealing. The angles of c-axis tilt grain boundaries are on average 14° and 26° for the fully processed tape and the tape after the first annealing, respectively. The intergrowth content (15%) and distribution are similar in these two tapes. |
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Language
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English
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Source (journal)
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Physica: C : superconductivity. - Amsterdam, 1988, currens
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Publication
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Amsterdam
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North-Holland
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2001
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ISSN
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0921-4534
[print]
1873-2143
[online]
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DOI
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10.1016/S0921-4534(00)01755-X
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Volume/pages
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353
:3/4
(2001)
, p. 251-257
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ISI
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000168861100012
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Full text (Publisher's DOI)
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